History

MicroLink was established in May 2000 and used venture investment to construct a clean room with manufacturing facilities. First product shipment took place in January 2002. The company has shown consistent growth since then.

MicroLink has a strong record of transitioning innovative power amplifier semiconductor products developed from in-house research into high-volume production. MicroLink currently produces InGaP epitaxial wafers, which are used in the manufacture of heterojunction bipolar transistors (HBTs). These transistors are used for high-volume cellular and WLAN applications and for RF test instrumentation. Our current products are used in a majority of the WCDMA cellular phones sold in Japan (3G NTT DoCoMo), in WLAN modules in personal computers and routers, and in RF test equipment.